LPM/Encapsulation

LPE-1-bigUnderfill, Potting, and Encapsulation are coating methods which provide superior protection for PCBs for Stress, Vibration & Impact. Potting is a method of immersing the part or assembly in a liquid resin and then curing it. Different from encapsulation, potting retains the shell that is used to contain the thermoset resin while it’s curing. Encapsulation is a method of creating a frame or mold around the object by filling the space between the frame and the object with thermosetting material, curing the resin and then removing the frame. Epoxies are most commonly used, however we offer a variety of materials to meet your requirements.

When Conformal Coating or Potting will not provide the required protection to your electronics consider Low Pressure Encapsulation. This method of encapsulation works well with PCB’s , connectors, switches, sensors , wire harnesses & cables; providing protection from water, moisture, dust, debris, vibration and impact.  Polyamide & Polyolefin materials are used in this process. These materials are lighter weight than epoxy and faster than potting and because LPM is a single step process, it is a fraction of the cost of potting.

Encapsulation creates a geometric shape that minimizes secondary operations allowing for a simpler assembly process.

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