Central Coating offers a variety of services to protect your PCB from harsh environmental conditions as well as from data theft and reverse engineering concerns. Our unique capabilities match our process with your specific applications allowing us to give you the best engineered solution provided in the most economical way. Central Coating offers a variety of services to protect your PCB over a wide range of concerns:
conformal coating 2Conformal Coating protects components from moisture, humidity, condensation & fungus. We offer many chemistries to meet your unique requirements. Central Coating has a dedicated ESD protected area for our Conformal Coating process, which meets or exceeds the ANSI/ESD S20.20 requirements. The Conformal Coatings provide protection against corrosion, moisture, thermal and mechanical shock to PCBs. Protecting your PCB or Electronic Devices from these harsh environmental conditions with conformal coating will help prolong the life of the device. We are ITAR Registered and registered with the US Department of State. We apply all MIL-I 46058C/IPC-CC-830 coatings.
Stress, Vibration, Impact
Underfill, Potting, and Encapsulation are coating methods which provide superior protection for PCBs for Stress, Vibration & Impact. Potting is a method of immersing the part or assembly in a liquid resin and then curing it. Different from encapsulation, potting retains the shell that is used to contain the thermoset resin while it’s curing. Encapsulation is a method of creating a frame or mold around the object by filling the space between the frame and the object with thermosetting material, curing the resin and then removing the frame. Epoxies are most commonly used, however we offer a variety of materials to meet your requirements.
Moisture, Dust & Vibration
When Conformal Coating or Potting will not provide the required protection to your electronics consider Low Pressure Encapsulation.
This method of encapsulation works well with PCB’s, connectors, switches, sensors , wire harnesses & cables; providing protection from water, moisture, dust, debris, vibration and impact. Polyamide & Polyolefin materials are used in this process. These materials are lighter weight than epoxy and faster than potting.
Encapsulation creates geometric shape that minimizes secondary operation allowing for a simpler assembly process.